The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9162251 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 20, 2015

Filed:

Apr. 06, 2012
Applicants:

Satoshi Hirano, Kanagawa, JP;

Yuichiro Yamauchi, Kanagawa, JP;

Masaru Akabayashi, Kanagawa, JP;

Toshihiko Hanamachi, Kanagawa, JP;

Inventors:

Satoshi Hirano, Kanagawa, JP;

Yuichiro Yamauchi, Kanagawa, JP;

Masaru Akabayashi, Kanagawa, JP;

Toshihiko Hanamachi, Kanagawa, JP;

Assignee:

NHK Spring Co., Ltd., Yokohama-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D 1/12 (2006.01); C23C 24/04 (2006.01); C23C 28/02 (2006.01); B32B 15/01 (2006.01); B05B 7/14 (2006.01); B05D 1/36 (2006.01); B32B 15/16 (2006.01); C23C 14/02 (2006.01); C23C 14/16 (2006.01); C23C 28/00 (2006.01); B22F 7/04 (2006.01);
U.S. Cl.
CPC ...
B05D 1/12 (2013.01); B05B 7/1486 (2013.01); B05D 1/36 (2013.01); B32B 15/01 (2013.01); B32B 15/16 (2013.01); C23C 14/025 (2013.01); C23C 14/16 (2013.01); C23C 24/04 (2013.01); C23C 28/021 (2013.01); C23C 28/023 (2013.01); C23C 28/42 (2013.01); B22F 2007/042 (2013.01); Y10T 428/12076 (2015.01);
Abstract

A lamination includes a substrate formed of a metal or alloy, an intermediate layer formed on a surface of the substrate and is formed of a metal or alloy that is softer than the substrate, and a metal film deposited by accelerating a powder material of a metal or alloy together with a gas heated to a temperature lower than the melting point of the powder material and spraying it onto the intermediate layer while keeping it in a solid phase.


Find Patent Forward Citations

Hirano, Satoshi. (2015). Lamination and method for manufacturing lamination (U.S. Patent No. 9162251). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9162251

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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