The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2015
Filed:
Jun. 27, 2014
Samsung Electro-mechanics Co., Ltd., Suwon-Si, KR;
Bum Sik Jang, Suwon-Si, KR;
Sung Min Song, Suwon-Si, KR;
Samsung Electro-Mechanics Co., Ltd., Gyeonggi-Do, KR;
Abstract
Disclosed herein are a power module package and a method for manufacturing the same. According to a preferred embodiment of the present invention, a power module package includes: a metal substrate having an insulating layer and a circuit pattern formed on one surface thereof; at least one first electronic device mounted on the circuit pattern; a lead frame disposed around the metal substrate; a molding area enclosing the metal substrate, the first electronic device, and a portion of the lead frame; and a heat sink including a connection part contacting the insulating layer and a body part disposed on a surface opposite to the first electronic device and including one surface bonded to the connection part and the other surface exposed from an upper surface of the molding area.