The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9161457 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 13, 2015

Filed:

Mar. 14, 2013
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon, KR;

Inventors:

Sung Jae Lee, Suwon, KR;

Byung Jae Kim, Suwon, KR;

Sang Jin Kim, Suwon, KR;

Soo Gil Shin, Suwon, KR;

Seung Hee Cho, Suwon, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H04N 5/225 (2006.01);
U.S. Cl.
CPC ...
H05K 3/30 (2013.01); H04N 5/2253 (2013.01); H04N 5/2254 (2013.01); H05K 3/305 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/09045 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/0165 (2013.01); Y10T 29/53174 (2015.01);
Abstract

Disclosed herein is an apparatus for manufacturing a camera module, the apparatus including: a base jig holding a PCB from below; a bonding head picking up an image sensor and attaching the image sensor onto the PCB; and a housing bonding tool picking up a housing assembly and attaching the housing assembly onto the PCB so that the image sensor attached onto the PCB is received in the housing assembly, wherein the base jig is constituted in a structure where the base jig is tension-movable in a vertical direction (Z-axial direction), so that an upper surface of the PCB is an identical reference plane for attaching the image sensor and the housing assembly when the image sensor is picked up by the bonding head and attached onto the PCB.


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Lee, Sung. (2015). Apparatus for manufacturing camera module (U.S. Patent No. 9161457). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9161457

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