The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2015
Filed:
Jun. 12, 2014
Microcosm Technology Co., Ltd., Tainan, TW;
Tang-Chieh Huang, Tainan, TW;
Microcosm Technology Co., Ltd., Tainan, TW;
Abstract
A method of forming a component-embedded printed circuit board includes: preparing a first layered structure; preparing a second layered structure that includes an adhesive film and a releasable film; attaching the second layered structure to the first layered structure to form a layered stack, the releasable film releasably covering a mounting region of the first layered structure; heating and pressing the layered stack; cutting the second layered structure through the adhesive film; removing the releasable film together with a portion of the adhesive film from the mounting region to form a hole in the second layered structure; and mounting an electronic component in the hole.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile