The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2015
Filed:
Sep. 28, 2012
Kyocera Corporation, Kyoto-shi, Kyoto, JP;
Kiyotaka Nakamura, Kirishima, JP;
Yoshio Ohashi, Satsumasendai, JP;
Kunihide Shikata, Kirishima, JP;
KYOCERA CORPORATION, Kyoto-Shi, JP;
Abstract
A circuit board is provided with a metal wiring layeron at least one principal surface of a ceramic sintered body, wherein the above-described metal wiring layer includes a first regionwhich is in contact with the principal surface and which contains a glass component and a second regionwhich is located on the first regionand which does not contain a glass component, the thickness of the first regionis 35% or more and 70% or less of the thickness of the metal wiring layer, and the average grain size in the first regionis smaller than the average grain size in the second region