The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2015
Filed:
May. 22, 2013
Applicant:
Yazaki Corporation, Tokyo, JP;
Inventors:
Hideki Yamanaka, Shizuoka, JP;
Hiromi Watanabe, Kanagawa, JP;
Assignee:
YAZAKI CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/55 (2011.01); H01R 12/57 (2011.01); H01R 12/72 (2011.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01R 12/57 (2013.01); H01R 12/55 (2013.01); H01R 12/724 (2013.01); H05K 3/3405 (2013.01); H05K 3/3447 (2013.01); H05K 2201/09145 (2013.01); H05K 2201/1034 (2013.01);
Abstract
A board connecting terminal includes a contact which comes into contact with a mate side terminal, and a solder part soldered to a pad part formed in a circuit board and connected to the contact. The solder part includes a solder part main body soldered to the pad part, a first engaging piece extended from the solder part main body and a second engaging piece extended from the solder part main body. The solder part main body is soldered to the pad part under a state that the first engaging piece and the second engaging piece are engaged with the circuit board.