The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2015

Filed:

Mar. 01, 2013
Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, Tokyo, JP;

Inventors:

Yukako Tsutsumi, Kawasaki, JP;

Koh Hashimoto, Yokohama, JP;

Takayoshi Ito, Yokohama, JP;

Koji Akita, Yokohama, JP;

Koji Ogura, Tachikawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/06 (2006.01); H01Q 1/22 (2006.01); H01Q 1/40 (2006.01); G06K 19/077 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2266 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/40 (2013.01); G06K 19/07773 (2013.01);
Abstract

According to one embodiment, a wireless device is provided with a semiconductor chip, a substrate, an antenna, and a sealing material. The chip includes a wireless circuit. The substrate has a plurality of terminals arranged on a first surface and the chip arranged on a second surface. The antenna includes a radiation element and is electrically connected to the chip. The sealing material seals the chip and the antenna. A distance between a first wall of the sealing material substantially parallel to the second surface and the radiation element is equal to or more than a distance between a second wall of the sealing material substantially perpendicular to the second surface and the radiation element.


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