The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2015

Filed:

Jul. 15, 2011
Applicants:

Karl Weidner, München, DE;

Johann Ramchen, Altdorf, DE;

Axel Kaltenbacher, Mintraching, DE;

Walter Wegleiter, Nittendorf, DE;

Bernd Barchmann, Regensburg, DE;

Stefan Gruber, Bad Addach, DE;

Georg Bogner, Lappersdorf, DE;

Inventors:

Karl Weidner, München, DE;

Johann Ramchen, Altdorf, DE;

Axel Kaltenbacher, Mintraching, DE;

Walter Wegleiter, Nittendorf, DE;

Bernd Barchmann, Regensburg, DE;

Stefan Gruber, Bad Addach, DE;

Georg Bogner, Lappersdorf, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/60 (2010.01); H01L 33/20 (2010.01); H01L 33/38 (2010.01); H01L 33/58 (2010.01); G02F 1/1335 (2006.01); H01L 25/075 (2006.01); H01L 33/40 (2010.01); H01L 33/46 (2010.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 33/20 (2013.01); H01L 33/38 (2013.01); H01L 33/58 (2013.01); G02F 1/133603 (2013.01); H01L 25/0753 (2013.01); H01L 25/0756 (2013.01); H01L 33/405 (2013.01); H01L 33/46 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A radiation-emitting component includes a semiconductor chip which has a first main surface, a second main surface on an opposite side from the first main surface and an active region that generates radiation; a carrier on which the semiconductor chip is fixed on the side of the second main surface; an output layer arranged on the first main surface of the semiconductor chip and forming a lateral output surface spaced apart from the semiconductor chip in a lateral direction, a recess tapering in a direction of the semiconductor chip being, formed in the output layer and deflecting radiation emerging from the first main surface during operation into the direction of the lateral output surface.


Find Patent Forward Citations

Loading…