The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2015

Filed:

Oct. 25, 2013
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon, KR;

Inventor:

Jin Won Choi, Yongin, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H05K 3/46 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/80 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H05K 3/4688 (2013.01); H01L 24/16 (2013.01); H01L 2224/16225 (2013.01); H05K 1/183 (2013.01); H05K 1/185 (2013.01); H05K 3/0097 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/09727 (2013.01); H05K 2203/061 (2013.01); H05K 2203/063 (2013.01); H05K 2203/1536 (2013.01);
Abstract

Provided is a hybrid substrate with high density and low density substrate areas and a method of manufacturing the same. The hybrid substrate with high density and low density substrate areas includes a low density substrate layer having a cavity and a low density area, a high density substrate layer mounted in the cavity of the low density substrate layer and formed of a high density area having a higher pattern density than that of the low density area, an insulating support layer comprising a deposition area formed on upper portions, lower portions and the upper and lower portions of the high density substrate layer and the low density substrate layer, insulating layer vias passing through the deposition area of the insulating support layer and connected to patterns of the high density substrate layer and the low density substrate layer, and an outer pattern layer.


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