The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2015
Filed:
Jul. 10, 2014
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Takami Otsuki, Tokyo, JP;
Rei Yoneyama, Tokyo, JP;
Akihiko Yamashita, Hyogo, JP;
Yoshitaka Kimura, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 23/12 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 23/12 (2013.01); H01L 24/49 (2013.01); H01L 2224/4912 (2013.01); H01L 2924/3701 (2013.01);
Abstract
A power module includes: a base plate having a front surface provided with positioning wire bonding portions; an insulating substrate provided with hole portions accommodating the positioning wire bonding portions on a side of a back surface facing the base plate, and fixed to the base plate with being positioned with respect to the base plate by the hole portions accommodating the positioning wire bonding portions; and a semiconductor chip arranged on a side of a front surface of the insulating substrate opposite to the back surface.