The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2015

Filed:

Feb. 18, 2014
Applicant:

Stmicroelectronics S.r.l., Agrate Brianza, IT;

Inventor:

Concetto Privitera, Gravina di Catania, IT;

Assignee:

STMicroelectronics S.r.l., Agrate Brianza, IT;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/267 (2006.01); H01L 33/00 (2010.01); H01L 29/40 (2006.01); H01L 23/48 (2006.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01); H01L 23/28 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 21/56 (2013.01); H01L 21/76877 (2013.01); H01L 23/28 (2013.01); H01L 23/49562 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 23/3107 (2013.01); H01L 24/02 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/13 (2013.01); H01L 24/29 (2013.01); H01L 24/30 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05009 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06051 (2013.01); H01L 2224/133 (2013.01); H01L 2224/13009 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/1329 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/16058 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/293 (2013.01); H01L 2224/29009 (2013.01); H01L 2224/29025 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29034 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/3003 (2013.01); H01L 2224/30051 (2013.01); H01L 2224/32058 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/8185 (2013.01); H01L 2224/81121 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81855 (2013.01); H01L 2224/83121 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/9201 (2013.01); H01L 2224/9211 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract

An electronic device is described comprising at least one chip enclosed in a package, in turn provided with a metallic structure or leadframe having a plurality of connection pins, this chip having at least one first contact realized on a first face and at least one second contact realized on a second and opposite face of this chip. The chip comprises at least one through via crossing the whole section of the chip as well as a metallic layer extending from the second contact arranged on the first face, along walls of the at least one through via up to the second and opposite face in correspondence with an additional pad. The electronic device comprises at least one interconnection layer for the electrical and mechanical connection between the chip and the metallic structure having at least one portion realized in correspondence with the at least one through via so as to bring the second contact placed on the second face of the chip back on its first face. An assembly process of such an electronic device is also described.


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