The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2015

Filed:

Jul. 09, 2012
Applicants:

Kurt-georg Besendörfer, Cadolzburg, DE;

Nadja Erdner, Leinburg, DE;

Jürgen Steger, Hiltpolstein, DE;

Inventors:

Kurt-Georg Besendörfer, Cadolzburg, DE;

Nadja Erdner, Leinburg, DE;

Jürgen Steger, Hiltpolstein, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/34 (2006.01); H01L 23/18 (2006.01); H01L 23/36 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 25/07 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01); H01L 23/18 (2013.01); H01L 23/36 (2013.01); H01L 23/3735 (2013.01); H01L 23/4985 (2013.01); H01L 23/49833 (2013.01); H01L 25/072 (2013.01); H05K 7/2039 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83101 (2013.01); H01L 2924/01068 (2013.01);
Abstract

A power electronic system with a cooling device, and a method for producing the system, comprising a plurality of submodules, each submodule having a first planar insulating material body, one first conductor track cohesively connected thereto, one power switch arranged on the conductor track, at least one internal connecting device composed of an alternate layer sequence of at least one electrically conductive film and at least one electrically insulating film, wherein at least one electrically conductive layer forms at least one second conductor track, and comprising external connection elements. In this case, the submodules are arranged cohesively or in a force-locking manner and in a manner spaced apart from one another with their first main surface on the cooling device. At least one second conductor track at least partially covers first conductor tracks of two submodules, electrically connects them to one another and covers an interspace between the submodules.


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