The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2015
Filed:
Jan. 17, 2014
Applicant:
Schott Ag, Mainz, DE;
Inventors:
Robert Hettler, Kumhausen, DE;
Kenneth Tan, Singapore, SG;
Georg Mittermeier, Altfraunhofen, DE;
Karsten Droegemueller, Eichenau, DE;
Assignee:
SCHOTT AG, Mainz, DE;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 29/32 (2006.01); H01L 23/08 (2006.01); H01L 23/66 (2006.01); H01L 23/64 (2006.01); H01L 23/045 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/08 (2013.01); H01L 23/045 (2013.01); H01L 23/64 (2013.01); H01L 23/66 (2013.01); H01L 23/3157 (2013.01); H01L 2223/6622 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/85203 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85207 (2013.01);
Abstract
A transistor outline housing is provided that has bonding wires on an upper surface. The bonding wires are reduced in length and have connection leads with an excess length at an end opposite the bonding end.