The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2015
Filed:
Apr. 24, 2012
Applicants:
Masayuki Yamamoto, Ibaraki, JP;
Chouhei Okuno, Ibaraki, JP;
Inventors:
Masayuki Yamamoto, Ibaraki, JP;
Chouhei Okuno, Ibaraki, JP;
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/50 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67132 (2013.01); B29C 65/50 (2013.01);
Abstract
A workpiece is unloaded from a wafer-receiving container. A first discriminating sensor detects a front surface of the workpiece, and determines either a semiconductor wafer or a spacer is the workpiece. Where the workpiece is a wafer, the first discriminating sensor also determines whether or not a protective tape is on the front surface of the workpiece. Where it is determined that a protective tape is not on the front surface, a second discriminating sensor detects a back surface of the wafer for discriminating the presence or absence of the protective tape.