The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2015

Filed:

May. 10, 2012
Applicants:

Timothy C. Shaw, Sammamish, WA (US);

Jim Tom Belesiu, Mill Creek, WA (US);

Sharon Drasnin, Seattle, WA (US);

Christopher Harry Stoumbos, Sammamish, WA (US);

Paul Henry Dietz, Redmond, WA (US);

Dennis J. Mathias, Kenmore, WA (US);

Rob Huala, Bellevue, WA (US);

Inventors:

Timothy C. Shaw, Sammamish, WA (US);

Jim Tom Belesiu, Mill Creek, WA (US);

Sharon Drasnin, Seattle, WA (US);

Christopher Harry Stoumbos, Sammamish, WA (US);

Paul Henry Dietz, Redmond, WA (US);

Dennis J. Mathias, Kenmore, WA (US);

Rob Huala, Bellevue, WA (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01H 9/26 (2006.01); H01H 13/72 (2006.01); H01H 13/76 (2006.01); G06F 3/02 (2006.01); H01H 13/79 (2006.01); H01H 13/78 (2006.01); H01H 13/785 (2006.01); G06F 1/16 (2006.01); H05K 5/02 (2006.01); H04M 1/02 (2006.01); H04M 1/725 (2006.01); G05B 11/01 (2006.01); G06F 3/041 (2006.01); H01H 13/704 (2006.01); H01H 13/82 (2006.01); G06F 3/00 (2006.01); G06F 3/01 (2006.01); H01H 13/702 (2006.01); H01H 13/14 (2006.01); H01H 13/703 (2006.01); G06F 9/54 (2006.01); G06F 11/30 (2006.01); G06F 13/10 (2006.01); G06F 3/023 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0202 (2013.01); G05B 11/01 (2013.01); G06F 1/1618 (2013.01); G06F 1/1654 (2013.01); G06F 1/1656 (2013.01); G06F 1/1662 (2013.01); G06F 1/1669 (2013.01); G06F 1/1681 (2013.01); G06F 1/1683 (2013.01); G06F 1/1684 (2013.01); G06F 3/002 (2013.01); G06F 3/01 (2013.01); G06F 3/023 (2013.01); G06F 3/0414 (2013.01); G06F 3/0416 (2013.01); G06F 9/541 (2013.01); G06F 11/3089 (2013.01); G06F 13/102 (2013.01); H01H 13/14 (2013.01); H01H 13/702 (2013.01); H01H 13/703 (2013.01); H01H 13/704 (2013.01); H01H 13/78 (2013.01); H01H 13/785 (2013.01); H01H 13/79 (2013.01); H01H 13/82 (2013.01); H04M 1/0216 (2013.01); H04M 1/0254 (2013.01); H04M 1/72527 (2013.01); H05K 5/0226 (2013.01); H05K 5/0234 (2013.01); H01H 9/26 (2013.01); H01H 2201/036 (2013.01); H01H 2205/006 (2013.01); H01H 2211/006 (2013.01); H01H 2217/004 (2013.01); H04M 1/0245 (2013.01); Y10T 16/5401 (2015.01); Y10T 16/551 (2015.01); Y10T 29/49826 (2015.01);
Abstract

Force concentrator techniques are described. In one or more implementations, a pressure sensitive key includes a sensor substrate having a plurality of conductors, a flexible contact layer spaced apart from the sensor substrate and configured to flex to contact the sensor substrate to initiate an input; and a force concentrator layer disposed proximal to the flexible contact layer on a side opposite the sensor substrate. The force concentrator layer has a pad disposed thereon that is configured to cause pressure applied to the force concentrator layer to be channeled through the pad to cause the flexible contact layer to contact the sensor substrate to initiate the input.


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