The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2015

Filed:

Sep. 25, 2012
Applicant:

Kabushiki Kaisha Toyota Chuo Kenkyusho, Nagakute-shi, Aichi-ken, JP;

Inventors:

Norio Fujitsuka, Nisshin, JP;

Takashi Ozaki, Nagakute, JP;

Keiichi Shimaoka, Nagoya, JP;

Yutaka Nonomura, Nagoya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 26/08 (2006.01);
U.S. Cl.
CPC ...
G02B 26/0841 (2013.01);
Abstract

Provided is technique for a semiconductor device including a substrate and a tilting plate which is tiltable relatively to the substrate, the technique being capable of effectively suppressing warpage of the tilting plate. The semiconductor device of the present specification includes a substrate and a tilting plate which is tiltable relatively to the substrate. In the semiconductor device, a rib formed of wavelike portions where a plate thickness is substantially uniform is formed on the tilting plate.


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