The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2015

Filed:

Feb. 18, 2014
Applicant:

Hitachi Metals, Ltd., Tokyo, JP;

Inventors:

Hiroki Yasuda, Mito, JP;

Kouki Hirano, Hitachinaka, JP;

Takumi Kobayashi, Hitachi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/36 (2006.01); H04B 10/00 (2013.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
G02B 6/428 (2013.01); G02B 6/4214 (2013.01); G02B 6/4257 (2013.01); G02B 6/423 (2013.01); G02B 6/4267 (2013.01);
Abstract

An optical module includes a circuit board, an optical element on the circuit board, a semiconductor circuit element thereon and electrically coupled with the optical element, an optical connection member formed on a back surface of the circuit board and including an optical fiber receiving groove, and a pressing plate disposed on a side opposite to the circuit board of the optical connection member so as to fix the optical fiber. The semiconductor circuit element is mounted nearer a tip side of the circuit board in relation to the optical element such that the circuit board, the optical connection member and a tip part of the optical fiber are sandwiched between the semiconductor circuit element and the pressing plate. The circuit board includes a plurality of electrodes to be electrically coupled with an equipment side circuit board formed on a tip part of a back surface of the circuit board.


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