The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2015
Filed:
Dec. 12, 2013
Applicant:
Fujikura Ltd., Tokyo, JP;
Inventors:
Assignee:
FUJIKURA LTD., Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); G02B 6/42 (2006.01); H01S 5/022 (2006.01); H01S 5/024 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4272 (2013.01); G02B 6/4257 (2013.01); G02B 6/4267 (2013.01); H01S 5/02272 (2013.01); G02B 6/426 (2013.01); G02B 6/4207 (2013.01); G02B 6/4219 (2013.01); G02B 6/4236 (2013.01); G02B 6/4238 (2013.01); G02B 6/4246 (2013.01); G02B 6/4248 (2013.01); G02B 6/4265 (2013.01); H01S 5/02208 (2013.01); H01S 5/02236 (2013.01); H01S 5/02284 (2013.01); H01S 5/02476 (2013.01);
Abstract
The semiconductor laser module () includes: a laser mount () having thereon a semiconductor laser chip (); a fiber mount () having thereon an optical fiber (); a submount () on which the laser mount () and the fiber mount () are placed; and a substrate () on which the submountis placed, the substrate () having protrusions (to) on a top surface thereof, the submountbeing joined to the substrate () with a soft solder () spread between the submount () and the substrate ().