The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9157783 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 13, 2015

Filed:

Jul. 23, 2012
Applicants:

Toshio Oike, Shimada, JP;

Kenichi Tanaka, Shimada, JP;

Ryo Hirose, Shimada, JP;

Takafumi Shimizu, Shimada, JP;

Inventors:

Toshio Oike, Shimada, JP;

Kenichi Tanaka, Shimada, JP;

Ryo Hirose, Shimada, JP;

Takafumi Shimizu, Shimada, JP;

Assignee:

YAZAKI CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 (2006.01); G01F 23/36 (2006.01); H01C 1/142 (2006.01); H01C 17/28 (2006.01); C22C 5/02 (2006.01); C22C 5/06 (2006.01); B05D 7/00 (2006.01); B05D 3/02 (2006.01); B32B 15/01 (2006.01);
U.S. Cl.
CPC ...
G01F 23/36 (2013.01); C22C 5/02 (2013.01); C22C 5/06 (2013.01); H01C 1/142 (2013.01); H01C 17/281 (2013.01); B05D 3/02 (2013.01); B05D 5/12 (2013.01); B05D 7/50 (2013.01); B32B 15/01 (2013.01); Y10T 428/12889 (2015.01);
Abstract

A method for producing a conductive segment, includes: a step of printing a metal conductive paste on a substrate, and drying the paste; a step of printing other metal conductive paste on the metal conductive paste after drying, and drying the paste; and a step of burning the metal conductive paste after drying and the other metal conductive paste after drying, wherein the conductive metal paste is an Ag—Pd conductive paste comprising silver (Ag) and palladium (Pd), and the other metal conductive paste is an Au conductive paste comprising gold (Au) as a main component; or the metal conductive paste is an Au conductive paste comprising gold (Au) as a main component, and the other metal conductive paste is an Ag—Pd conductive paste comprising silver (Ag) and palladium (Pd).


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