The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2015

Filed:

Aug. 25, 2010
Applicants:

Binhai Yu, Guangdong, CN;

Bairong Sun, Guangdong, CN;

Weiping LI, Guangdong, CN;

Xunli Xia, Guangdong, CN;

Cheng LI, Guangdong, CN;

Menghua Long, Guangdong, CN;

Lifang Liang, Foshan, CN;

Inventors:

Binhai Yu, Guangdong, CN;

Bairong Sun, Guangdong, CN;

Weiping Li, Guangdong, CN;

Xunli Xia, Guangdong, CN;

Cheng Li, Guangdong, CN;

Menghua Long, Guangdong, CN;

Lifang Liang, Foshan, CN;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F21V 19/00 (2006.01); F21V 21/00 (2006.01); H01L 33/48 (2010.01); B23P 11/00 (2006.01); H05K 1/18 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
F21V 21/00 (2013.01); B23P 11/00 (2013.01); H01L 33/486 (2013.01); H05K 1/183 (2013.01); H01L 33/62 (2013.01); H01L 2224/48247 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01); H05K 2201/0394 (2013.01); H05K 2201/10106 (2013.01); Y10T 29/49996 (2015.01);
Abstract

A manufacture method for a surface mounted power LED support comprises providing a wiring board having both sided metal layers. In addition, the method comprises forming a hole. Further, the method comprises setting a metal layer in the surface of the hole. Still further, the method comprises thickening the metal layer of the wiring board. The method also comprises etching the metal layer of the wiring board. Moreover, the method comprises cutting the wiring board to form single support unit. A surface mounted power LED support comprises a both sided wiring board, a hole formed in the wiring board and wiring layers set on the surface of the wiring board.


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