The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2015

Filed:

Jun. 19, 2014
Applicants:

Huga Optotech Inc., Taichung, TW;

Interlight Optotech Corporation, Yangmei, Taoyuan County, TW;

Inventors:

Hong-Zhi Liu, Yangmei, TW;

Tzu-Chi Cheng, Yangmei, TW;

Assignees:

HUGA OPTOTECH INC., Taichung, TW;

INTERLIGHT OPTOTECH CORPORATION, Yangmei, Taoyuan Country, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21K 99/00 (2010.01); F21V 19/00 (2006.01); H01L 25/075 (2006.01); F21Y 101/02 (2006.01); F21Y 103/00 (2006.01); F21Y 111/00 (2006.01); H01L 33/62 (2010.01); H05K 1/11 (2006.01); H05K 3/28 (2006.01); H05K 3/32 (2006.01); H05K 3/34 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
F21K 9/00 (2013.01); F21K 9/135 (2013.01); F21K 9/90 (2013.01); F21V 19/003 (2013.01); F21Y 2101/02 (2013.01); F21Y 2103/003 (2013.01); F21Y 2111/001 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/73265 (2013.01); H05K 1/117 (2013.01); H05K 3/285 (2013.01); H05K 3/326 (2013.01); H05K 3/3405 (2013.01); H05K 3/366 (2013.01); H05K 2201/09481 (2013.01); H05K 2201/10674 (2013.01);
Abstract

Disclosed is an LED assembly having an omnidirectional light field. The LED assembly has a transparent substrate, LED chips, and first and second electrode plates. The transparent substrate comprises first and second surfaces facing to opposite orientations respectively. The transparent substrate has a via hole tunneling therethrough, which is formed with conductive material to provide a conductive via. The LED chips are mounted on the first surface. The first and second electrode plates are formed on the first and second surfaces respectively. The light emitting diode chips and the conductive via are electrically connected in series between the first and second electrode plates.


Find Patent Forward Citations

Loading…