The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2015
Filed:
Dec. 20, 2007
Hiroki Ikeda, Himeji, JP;
Katsu Yanagimoto, Himeji, JP;
Noriaki Matsubara, Himeji, JP;
Sanyo Special Steel Co., Ltd., Himeji-shi, Hyogo-ken, JP;
Abstract
The present invention provides a high-temperature lead-free solder alloy which has no variation in strength of the soldered portion and has an excellent balance between strength and soldering properties, and a method for producing the alloy. The present invention relates to a lead-free jointing material made of an alloy of two elements A and B selected from elements other than Pb, wherein the element A has a melting point higher than a melting point of the element B, wherein the alloy is an alloy which has a room-temperature stable phase composed of the element B and a room-temperature stable phase ABcomposed of the elements A and B (provided that m and n are specific numerals in accordance with an alloy constituting a stable phase at room temperature) and satisfies AB(provided that 0<x<m(m+n)), and wherein the element A is supersaturatedly dissolved in the room-temperature stable phase composed of the element B.