The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2015

Filed:

Mar. 26, 2013
Applicant:

Jiali Wu, Yorktown Heights, NY (US);

Inventor:

Jiali Wu, Yorktown Heights, NY (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 5/14 (2006.01); H05K 7/20 (2006.01); B82Y 30/00 (2011.01); C08K 3/22 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); H05K 7/20509 (2013.01); B82Y 30/00 (2013.01); C08K 3/22 (2013.01); H01L 2924/00 (2013.01); Y10T 428/2982 (2015.01);
Abstract

A ternary particle size filler composition with addition of nano particles is provided to formulate thermally conductive interface materials such as soft gel having a high thermal conductivity, a relative low viscosity, and a low complex storage modulus. The thermally conductive material containing thermal particle composition and polymer matrix is used to create a thermal transfer path between the electronic component and the heat dissipation member. The composition is a mixture of a ternary particle size fillers constituted of the same or different chemical compounds in a predefined size ranges and volume ratios in terms of low viscosity and thermal interface nominal size. A silicone based polymer used as filler bonding matrix contains base resin, dispersant, cross-linker and polymerization catalyst. Thermal conductivity of the soft gel varied according to the change of volume percentage, particle size, and chemical compound of individual thermal particles.


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