The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2015

Filed:

Nov. 15, 2013
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Yong Hun Lee, Daejeon, KR;

Kyu Pal Kim, Daejeon, KR;

Chang Sun Han, Daejeon, KR;

Gi Cheul Kim, Daejeon, KR;

Chul Hee Ryu, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 20/06 (2006.01); C08J 3/05 (2006.01); C08J 11/04 (2006.01); C08L 33/08 (2006.01);
U.S. Cl.
CPC ...
C08L 33/08 (2013.01); C08L 2205/025 (2013.01);
Abstract

A method of preparing a super absorbent polymer (SAP) includes the steps of preparing a first hydrogel polymer by carrying out a thermal polymerization or photo polymerization of a monomer composition including a water-soluble ethylene-based unsaturated monomer and a polymerization initiator; preparing a second hydrogel polymer by carrying out a thermal polymerization or photo polymerization of a monomer composition including a water-soluble ethylene-based unsaturated monomer and a polymerization initiator; drying and milling the first hydrogel polymer and distributing the first hydrogel polymer into a fine powder having a particle diameter below 150 μm and a base resin having a particle diameter of 150 μm to 850 μm; fabricating a reassembled body of the fine powder by mixing the fine powder and the second hydrogel polymer; and mixing the reassembled body of the fine powder with the first hydrogel polymer, and drying and milling the same.


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