The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2015

Filed:

Sep. 21, 2011
Applicants:

Meiten Koh, Settsu, JP;

Eri Mukai, Settsu, JP;

Nobuyuki Komatsu, Settsu, JP;

Kouji Yokotani, Settsu, JP;

Mayuko Tatemichi, Settsu, JP;

Kakeru Hanabusa, Settsu, JP;

Takahiro Kitahara, Settsu, JP;

Takuma Kawabe, Settsu, JP;

Inventors:

Meiten Koh, Settsu, JP;

Eri Mukai, Settsu, JP;

Nobuyuki Komatsu, Settsu, JP;

Kouji Yokotani, Settsu, JP;

Mayuko Tatemichi, Settsu, JP;

Kakeru Hanabusa, Settsu, JP;

Takahiro Kitahara, Settsu, JP;

Takuma Kawabe, Settsu, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08F 14/26 (2006.01); C08F 214/26 (2006.01); C08L 27/18 (2006.01); H01G 4/18 (2006.01); H01G 4/20 (2006.01); H01G 4/33 (2006.01); C08J 5/18 (2006.01); C08K 3/22 (2006.01);
U.S. Cl.
CPC ...
C08F 214/26 (2013.01); C08F 14/26 (2013.01); C08F 214/262 (2013.01); C08J 5/18 (2013.01); C08L 27/18 (2013.01); H01G 4/18 (2013.01); H01G 4/20 (2013.01); H01G 4/33 (2013.01); C08J 2327/18 (2013.01); C08K 3/22 (2013.01);
Abstract

Provided is a film for a film capacitor in which electrical insulation, and especially electrical properties at high temperatures are improved while a high dielectric constant of a vinylidene fluoride resin is maintained. The film for a film capacitor includes a tetrafluoroethylene resin (a1) that includes a vinylidene fluoride unit and a tetrafluoroethylene unit in the vinylidene fluoride unit/tetrafluoroethylene unit ratio (mol %) of 0/100 to 49/51 as a film-forming resin (A).


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