The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2015
Filed:
Oct. 10, 2013
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon, KR;
Inventors:
Kyung Ho Lee, Suwon, KR;
Seung Wan Woo, Suwon, KR;
Po Chul Kim, Anyang, KR;
Young Nam Hwang, Suwon, KR;
Suk Jin Ham, Seoul, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); H05K 1/02 (2006.01); H05K 3/28 (2006.01); H01L 23/00 (2006.01); H01L 23/06 (2006.01); H01L 23/16 (2006.01); H05K 3/34 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H01L 23/562 (2013.01); H05K 3/285 (2013.01); H01L 23/06 (2013.01); H01L 23/16 (2013.01); H01L 23/3171 (2013.01); H01L 2924/3511 (2013.01); H05K 3/3431 (2013.01); H05K 2201/0175 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/068 (2013.01); H05K 2203/1327 (2013.01);
Abstract
Disclosed herein is an electronic component package including: a connection member provided on at least one surface of a substrate; an active element coupled to the substrate by the connection member; a molding part covering an exposed surface of the active element; and an additional layer formed on an exposed surface of the molding part to decrease a warpage phenomenon. In the electronic component package, the warpage phenomenon may be decreased as compared with the related art.