The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2015

Filed:

Jun. 27, 2012
Applicants:

Karlheinz Wienand, Aschaffenburg, DE;

Matsvei Zinkevich, Goldbach, DE;

Inventors:

Karlheinz Wienand, Aschaffenburg, DE;

Matsvei Zinkevich, Goldbach, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41B 5/00 (2006.01); H05B 3/28 (2006.01); H05K 13/00 (2006.01); B29C 43/52 (2006.01); H05K 1/03 (2006.01); H05K 1/16 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05B 3/28 (2013.01); H05B 3/283 (2013.01); H05K 13/00 (2013.01); B29C 43/52 (2013.01); B29K 2909/02 (2013.01); H05K 1/0306 (2013.01); H05K 1/167 (2013.01); H05K 3/281 (2013.01); Y10T 29/49146 (2015.01);
Abstract

A stamping die for hot stamping a material includes a profiled stamping surface, wherein the stamping die includes at least one thermally insulating substrate, on which an electrically conductive structure having a heating resistor is arranged, and wherein the electrically conductive structure is covered by an electrically insulating film. The surface of the electrically insulating film includes the profiled stamping surface and the electrically insulating film covers at least the heating resistor such that the electrically insulating film with the stamping surface can be electrically heated by the heating resistor. A method for hot stamping a material using such a stamping die includes heating the resistor to a temperature between 100° C. and 800° C.


Find Patent Forward Citations

Loading…