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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9153762 B1

PDFFull Text
Expired
Date of Patent:
Oct. 06, 2015

Filed:

Aug. 14, 2013

Electronic component package structure

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventor:

Tadamasa Miura, Nagaokakyo, JP;

Assignee:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Zandra Smith

Assistant Examiner:

John M Parker

Int. Cl.
CPC ...
H01L 31/058 (2006.01); H01L 35/02 (2006.01); H01C 7/00 (2006.01); H01L 35/34 (2006.01); H01C 1/012 (2006.01); H01C 17/065 (2006.01); H01C 7/04 (2006.01); H01C 1/14 (2006.01); H01C 1/142 (2006.01);
U.S. Cl.
CPC ...
H01L 35/02 (2013.01); H01C 1/012 (2013.01); H01C 7/008 (2013.01); H01C 7/042 (2013.01); H01C 17/06533 (2013.01); H01L 35/34 (2013.01); H01C 1/142 (2013.01); H01C 1/1413 (2013.01); H01C 7/04 (2013.01);
Abstract

A thermistor includes a metal substrate, a semiconductor ceramic layer on the metal substrate, and a pair of split electrodes on the semiconductor layer. The semiconductor ceramic layer is formed by a solid-phase method. The metal substrate includes ceramic particles and is not interrupted in the direction of thickness by the ceramic particles or a pillar defined by a chain of the ceramic particles. Preferably, the metal substrate and the ceramic layer of the thermistor have a thickness of about 10 μm to about 80 μm and about 1 μm to about 10 μm, respectively.

Find Patent Forward Citations

Miura, Tadamasa. (2015). Electronic component package structure (U.S. Patent No. 9153762). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9153762

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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