The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2015

Filed:

Aug. 30, 2012
Applicant:

Xiaofeng BI, Guangdong, CN;

Inventor:

Xiaofeng Bi, Guangdong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 7/20 (2006.01); H01L 33/64 (2010.01); H05K 1/02 (2006.01); H01L 23/367 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 33/64 (2013.01); H05K 1/0204 (2013.01); H01L 21/4878 (2013.01); H01L 23/3677 (2013.01); H01L 2924/0002 (2013.01); H05K 3/0061 (2013.01); H05K 2201/09054 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/0323 (2013.01); Y10T 29/49124 (2015.01);
Abstract

A method of making a heat radiating structure for high-power LED comprises: (1) preparing a PCB board, a heat conducting plate having a heat conducting column at one side thereof and a heat radiating plate; (2) providing a locating hole penetrating both sides of the PCB board, and welding a copper plate to one side of the PCB board, while soldering an electrode welding leg to the other side of the PCB board; (3) putting the heat conducting column into the locating hole, and soldering the copper plate and the heat conducting plate together; (4) placing the one-piece of the heat conducting plate and the PCB board produced by the step (3) on a pressing equipment to adjust the height of the conducting column; (5) pasting the inner side of the heat radiating plate on the other side of the heat conducting plate fixedly.


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