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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9153648 B1

PDFFull Text
Expired
Date of Patent:
Oct. 06, 2015

Filed:

Apr. 03, 2012

Semiconductor stacked body, method for manufacturing same, and semiconductor element

Applicants:

Shinkuro Sato, Tokyo, JP;

Akito Kuramata, Tokyo, JP;

Yoshikatsu Morishima, Tokyo, JP;

Kazuyuki Iizuka, Tokyo, JP;

Inventors:

Shinkuro Sato, Tokyo, JP;

Akito Kuramata, Tokyo, JP;

Yoshikatsu Morishima, Tokyo, JP;

Kazuyuki Iizuka, Tokyo, JP;

Assignees:

TAMURA CORPORATION, Tokyo, JP;

KOHA CO, LTD., Tokyo, JP;

Attorney:

McGinn IP Law Group, PLLC

Primary Examiner:

Tucker Wright

Int. Cl.
CPC ...
H01L 29/20 (2006.01); H01L 29/267 (2006.01); H01L 29/737 (2006.01); H01L 29/778 (2006.01); H01L 29/78 (2006.01); H01L 29/812 (2006.01); H01L 29/872 (2006.01); C23C 16/02 (2006.01); C23C 16/30 (2006.01); H01L 21/02 (2006.01); C30B 25/18 (2006.01); C30B 29/40 (2006.01); H01L 33/00 (2010.01); H01L 33/12 (2010.01); H01L 33/32 (2010.01);
U.S. Cl.
CPC ...
H01L 29/2003 (2013.01); C23C 16/0218 (2013.01); C23C 16/0227 (2013.01); C23C 16/0272 (2013.01); C23C 16/303 (2013.01); C30B 25/183 (2013.01); C30B 29/403 (2013.01); H01L 21/0254 (2013.01); H01L 21/0262 (2013.01); H01L 21/02414 (2013.01); H01L 21/02433 (2013.01); H01L 21/02458 (2013.01); H01L 21/02576 (2013.01); H01L 29/267 (2013.01); H01L 29/7371 (2013.01); H01L 29/7788 (2013.01); H01L 29/7789 (2013.01); H01L 29/7827 (2013.01); H01L 29/8122 (2013.01); H01L 29/8128 (2013.01); H01L 29/872 (2013.01); H01L 33/007 (2013.01); H01L 33/12 (2013.01); H01L 33/32 (2013.01);
Abstract

A method for manufacturing a semiconductor stacked body, and a semiconductor element including the semiconductor stacked body includes a semiconductor stacked body, including a GaOsubstrate having, as a principal plane, a plane on which oxygen atoms are arranged in a hexagonal lattice, an AlN buffer layer formed on the GaOsubstrate, and a nitride semiconductor layer formed on the AlN buffer layer.

Find Patent Forward Citations

Sato, Shinkuro. (2015). Semiconductor stacked body, method for manufacturing same, and semiconductor element (U.S. Patent No. 9153648). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9153648

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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