logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9153616 B1

PDFFull Text
Date of Patent:
Oct. 06, 2015

Filed:

Dec. 26, 2012

Solid-state imaging device and imaging device with circuit elements distributed on multiple substrates, method of controlling solid-state imaging device, and imaging device with circuit elements distributed on multiple substrates

Applicant:

Olympus Corporation, Tokyo, JP;

Inventor:

Toru Kondo, Tokyo, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:

Westerman, Hattori, Daniels & Adrian, LLP

Primary Examiner:

Hung Lam

Int. Cl.
CPC ...
H04N 5/374 (2011.01); H01L 27/146 (2006.01); H04N 5/335 (2011.01);
U.S. Cl.
CPC ...
H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H04N 5/374 (2013.01);
Abstract

In the solid-state imaging device, first and second substrates are electrically connected to each other via connectors electrically connecting the first and second substrates. A photoelectric conversion element is disposed in the first substrate. A read circuit is disposed in the second substrate and reads a signal generated by the photoelectric conversion element and transmitted via the connector. In a signal processing circuit including elements or circuits performing signal processing on the read signal, some of the elements or circuits are disposed in the first substrate, the remaining elements or circuits are disposed in the second substrate, and the elements or circuits disposed in the first and second substrates are electrically connected to each other via the connector.

Find Patent Forward Citations

Quick Actions:

Kondo, Toru. (2015). Solid-state imaging device and imaging device with circuit elements distributed on multiple substrates, method of controlling solid-state imaging device, and imaging device with circuit elements distributed on multiple substrates (U.S. Patent No. 9153616). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9153616

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…