The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2015
Filed:
Apr. 10, 2013
Applicant:
Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);
Inventor:
Jon W. Brunner, Sellersville, PA (US);
Assignee:
Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/45 (2013.01); H01L 24/85 (2013.01); H01L 24/78 (2013.01); H01L 2224/45 (2013.01); H01L 2224/48463 (2013.01); H01L 2224/78301 (2013.01); H01L 2224/78925 (2013.01); H01L 2224/85 (2013.01); H01L 2224/859 (2013.01); H01L 2224/85045 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85207 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01006 (2013.01);
Abstract
A method of adjusting ultrasonic bonding energy on a wire bonding machine, the method comprising the steps of: providing a reference relationship between free air ball squash and ultrasonic bonding energy; determining an actual relationship between free air ball squash and ultrasonic bonding energy on a subject wire bonding machine; and adjusting at least one ultrasonic bonding energy setting of the subject wire bonding machine such that the actual relationship of the subject wire bonding machine is closer to the reference relationship.