The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2015
Filed:
Nov. 07, 2014
Skyworks Solutions, Inc., Woburn, MA (US);
Steve X. Liang, San Diego, CA (US);
SKYWORKS SOLUTIONS, INC., Woburn, MA (US);
Abstract
A flip chip packaged component includes a die having a first surface and a dielectric barrier disposed on the first surface of the die. The dielectric barrier at least partially surrounds a designated location on the first surface of the die. A plurality of bumps is disposed on the first surface of the die on an opposite side of the dielectric barrier from the designated location. The flip chip packaged component further includes a substrate having a plurality of bonding pads on a second surface thereof. A cavity is defined by the first surface of the die, the dielectric barrier, and the substrate. A molding compound encapsulates the die and at least a portion of the substrate.