The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9153549 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 06, 2015

Filed:

Feb. 12, 2013
Applicant:

Noda Screen Co., Ltd., Aichi, JP;

Inventors:

Seisei Oyamada, Kashiwa, JP;

Masamitsu Yoshizawa, Tokyo, JP;

Hirotaka Ogawa, Owariasahi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01); H01L 23/60 (2006.01); H01L 23/64 (2006.01); H01L 25/065 (2006.01); H05K 1/14 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H01L 24/07 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/50 (2013.01); H01L 23/60 (2013.01); H01L 23/64 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H05K 1/141 (2013.01); H01L 24/06 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/14133 (2013.01); H01L 2224/14135 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81815 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06572 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/15321 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/171 (2013.01); H01L 2924/351 (2013.01); H05K 3/368 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/2036 (2013.01);
Abstract

A semiconductor device includes a semiconductor chip, an interposer, a surface circuit pattern, and a post array. The surface circuit pattern is formed on one surface of the interposer and includes chip side pads connected to an external connection pad of the semiconductor chip, junction pads, and interconnecting lines having an end connected to the chip side pads and another end connected to the junction pads. The interconnecting lines extend from the chip side pads toward an outer edge of the interposer. The post array includes conducting paths and insulating resin insulating the conductive paths from each other. The post array is arranged such that the conductive paths extend in a direction intersecting with the surface of the interposer. The conducting paths each have an end connected to the junction pad and another end to be connected to the printed wiring board.


Find Patent Forward Citations

Oyamada, Seisei. (2015). Semiconductor device (U.S. Patent No. 9153549). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9153549

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…