The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2015
Filed:
Sep. 16, 2013
Applicant:
Luxvue Technology Corporation, Santa Clara, CA (US);
Inventors:
Clayton Ka Tsun Chan, Fremont, CA (US);
Andreas Bibl, Los Altos, CA (US);
Assignee:
Lux Vue Technology Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 24/00 (2013.01); H01L 25/0753 (2013.01); H01L 27/156 (2013.01); H01L 33/0079 (2013.01);
Abstract
A method and structure for forming an array of micro devices is disclosed. An array of micro devices is formed over an array of stabilization posts included in a stabilization layer. Patterned sacrificial spacers are formed between the stabilization posts and between the micro devices. The patterned sacrificial spacers are disposed upon the patterned sacrificial spacers.
Chan, Clayton Ka Tsun. (2015). Adhesive wafer bonding with sacrificial spacers for controlled thickness variation (U.S. Patent No. 9153548). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9153548
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile