The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2015
Filed:
Feb. 15, 2008
Applicant:
Junji Tanaka, Tokyo, JP;
Inventor:
Junji Tanaka, Tokyo, JP;
Assignee:
Cypress Semiconductor Corporation, San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/495 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/12 (2006.01); H01L 23/053 (2006.01); H01L 29/40 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2006.01); H01L 25/10 (2006.01); H05K 1/18 (2006.01); H01L 25/03 (2006.01); H05K 1/11 (2006.01); H05K 3/20 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 25/03 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H05K 1/187 (2013.01); H01L 24/48 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/15311 (2013.01); H05K 1/113 (2013.01); H05K 3/20 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/09527 (2013.01); H05K 2203/049 (2013.01);
Abstract
A semiconductor device includes a first insulator film having a first opening, a first wiring layer extending from the first opening onto the first insulator film, a first semiconductor chip mounted on the first insulator film so as to be electrically coupled with the first wiring layer, and a resin portion applied on the first insulation film to cover the first semiconductor chip.