The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2015

Filed:

Apr. 22, 2014
Applicant:

Microsemi Corporation, Aliso Viejo, CA (US);

Inventor:

Cecil Kent Walters, Scottsdale, AZ (US);

Assignee:

Microsemi Corporation, Aliso Viejo, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 29/16 (2006.01); H01L 23/00 (2006.01); H01L 23/051 (2006.01); H01L 23/488 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3107 (2013.01); H01L 23/051 (2013.01); H01L 23/488 (2013.01); H01L 24/33 (2013.01); H01L 29/1608 (2013.01); H01L 2224/33051 (2013.01); H01L 2924/00 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/01042 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/12032 (2013.01);
Abstract

A system can include a semiconductor die having a first side and a second side opposite the first side. The system can also include a first slug coupled to a portion of the first side of the die. The system can further include a second slug coupled to a portion of the second side of the die. The system can additionally include an insulating material voidlessly encapsulating the die. The first slug can include a first portion having a first width in proximity to the die and a second portion having a second width. The first portion can be closer than the second portion to the die and the first width can be smaller than the second width.


Find Patent Forward Citations

Loading…