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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9153515 B1

PDFFull Text
Date of Patent:
Oct. 06, 2015

Filed:

Mar. 02, 2011

Method for producing semiconductor encapsulating resin composition and pulverizing apparatus

Applicants:

Takafumi Sumiyoshi, Tokyo, JP;

Hiroshi Shibata, Tokyo, JP;

Inventors:

Takafumi Sumiyoshi, Tokyo, JP;

Hiroshi Shibata, Tokyo, JP;

Assignee:

SUMITOMO BAKELITE COMPANY LIMITED, Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Edward Cain

Int. Cl.
CPC ...
C08J 3/12 (2006.01); H01L 23/31 (2006.01); B02C 19/06 (2006.01); C08G 59/62 (2006.01); C08L 63/00 (2006.01); H01L 21/56 (2006.01); C08K 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3107 (2013.01); B02C 19/061 (2013.01); C08G 59/621 (2013.01); C08J 3/12 (2013.01); C08J 3/122 (2013.01); C08L 63/00 (2013.01); H01L 21/56 (2013.01); C08J 2463/00 (2013.01); C08K 3/0033 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A pulverizing apparatus is a gas stream type pulverizing apparatus. The pulverizing apparatus has a pulverizing unit for pulverizing a composition, a cooling device, a high-pressure air generating device and a collecting unit for receiving the pulverized composition. The chamber has a bottom portion, an outlet formed in the bottom portion for discharging the pulverized first composition therethrough and a wall portion formed in the bottom portion so as to surround the outlet. A plurality of first nozzles and a second nozzle are provided on a side portion of the chamber and a tubular supply unit is provided on an upper portion of the second nozzle. The gas pressure supplied into the chamber is 0.3 MPa or more, the gas temperature is 20° C. or less, and the humidity of the gas is 40% RH or less.

Find Patent Forward Citations

Sumiyoshi, Takafumi. (2015). Method for producing semiconductor encapsulating resin composition and pulverizing apparatus (U.S. Patent No. 9153515). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9153515

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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