The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2015

Filed:

Sep. 11, 2012
Applicants:

Young Ho Sohn, Gyunggi-do, KR;

Young Hoon Kwak, Gyunggi-do, KR;

Jong Man Kim, Gyunggi-do, KR;

Kyu Hwan OH, Gyunggi-do, KR;

Tae Hyun Kim, Gyunggi-do, KR;

Inventors:

Young Ho Sohn, Gyunggi-do, KR;

Young Hoon Kwak, Gyunggi-do, KR;

Jong Man Kim, Gyunggi-do, KR;

Kyu Hwan Oh, Gyunggi-do, KR;

Tae Hyun Kim, Gyunggi-do, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/72 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3107 (2013.01); H01L 23/3735 (2013.01); H01L 23/4334 (2013.01); H01L 23/49537 (2013.01); H01L 23/49575 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13034 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/19107 (2013.01);
Abstract

Disclosed herein is a power module package including: a first substrate having one surface and the other surface; a second substrate contacting one surface of the first substrate; a third substrate contacting one side of the other surface of the first substrate; a first lead frame contacting the other side of the other surface of the first substrate; and a second lead frame electrically connected to the third substrate.


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