The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2015
Filed:
Jul. 18, 2014
Applicant:
Samsung Sdi Co, Ltd., Yongin-si, Gyeonggi-do, KR;
Inventors:
Woo Chul Na, Uiwang-si, KR;
Seung Han, Uiwang-si, KR;
Assignee:
SAMSUNG SDI CO., LTD., Yongin-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); C08K 7/18 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/295 (2013.01); C08K 7/18 (2013.01); H01L 24/17 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/1713 (2013.01);
Abstract
An epoxy resin composition includes an inorganic filler, an epoxy resin, and a curing agent. The inorganic filler has an average particle diameter D50 from about 2 μm to about 10 μm, an average particle diameter D10 of about 3 μm or less, and an average particle diameter D90 from about 6 μm to about 15 μm. Inorganic filler particles having a particle diameter of about 25 μm or more constitute about 0.1 wt % or less of the inorganic filler.