The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2015
Filed:
Sep. 11, 2013
Kabushiki Kaisha Toshiba, Minato-ku, JP;
Masafumi Sugimoto, Kanagawa, JP;
Eiichi Hosomi, Kanagawa, JP;
Atsushi Murakawa, Kanagawa, JP;
Kazumi Takahashi, Kanagawa, JP;
Kazuhito Higuchi, Kanagawa, JP;
Susumu Obata, Kanagawa, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A semiconductor device includes a semiconductor substrate provided with a predetermined element and having wirings formed on its main surface connected to back wirings by a plurality of through silicon vias (TSVs), and a conductive cover which covers the main surface of the semiconductor substrate. The semiconductor substrate and the conductive cover are bonded to each other with a conductive bonding member. The TSV bonded to the conductive cover with the conductive bonding member is connected to an external electrode pad to which a ground potential is supplied.