The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2015
Filed:
Feb. 06, 2014
Applicant:
Hojin Platech Co., Ltd., Ansan-Si, KR;
Inventors:
Assignee:
HOJIN PLATECH CO., LTD., Ansan-Si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/38 (2006.01); C23C 18/40 (2006.01);
U.S. Cl.
CPC ...
C25D 3/38 (2013.01);
Abstract
The present invention relates to a copper plating solution for relieving the deposit stress of an electroplated copper film. In the copper electroplating solution of the present invention, glycerin propoxylate ethoxylate is used as a carrier for relieving the deposit stress, and phenylurea is added as a deposit stress relieving additive. The copper electroplating solution of the present invention includes the phenylurea by from about 0.02 to about 0.08 g/l.