The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2015

Filed:

Nov. 14, 2008
Applicants:

Baomin Xu, San Jose, CA (US);

Karl A. Littau, Palo Alto, CA (US);

Scott A. Elrod, La Honda, CA (US);

Inventors:

Baomin Xu, San Jose, CA (US);

Karl A. Littau, Palo Alto, CA (US);

Scott A. Elrod, La Honda, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 (2006.01); C25D 5/34 (2006.01); H01B 13/00 (2006.01); C23C 18/16 (2006.01); C23C 18/31 (2006.01); H01L 31/0224 (2006.01);
U.S. Cl.
CPC ...
C23C 18/161 (2013.01); C23C 18/165 (2013.01); C23C 18/1632 (2013.01); C23C 18/1651 (2013.01); C23C 18/1653 (2013.01); C23C 18/31 (2013.01); H01L 31/022425 (2013.01); Y02E 10/50 (2013.01);
Abstract

Inline methods for forming a photovoltaic cell electrode structure, wherein the photovoltaic cell includes a semiconductor substrate having a passivation layer thereon, includes providing a plurality of contact openings through the passivation layer to the semiconductor substrate, selectively plating a contact metal into the plurality of contact openings by printing electroless plating solution into the plurality of contact openings to deposit the contact metal, depositing a metal containing material on the deposited contact metal, and firing the deposited contact metal and the deposited metal containing material. The metal containing material may include a paste containing a silver or silver alloy along with a glass frit and is substantially free to completely free of lead. The methods may also use light activation of the passivation layer or use seed layers to assist in the plating.


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