The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2015
Filed:
Oct. 29, 2012
Applicants:
Sony Corporation, Tokyo, JP;
Sony Dadc Corporation, Tokyo, JP;
Inventors:
Naoki Okawa, Shizuoka, JP;
Yukie Suzuki, Shizuoka, JP;
Assignees:
SONY CORPORATION, Tokyo, JP;
SONY DADC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01); B81C 3/00 (2006.01); B29C 65/48 (2006.01);
U.S. Cl.
CPC ...
B81C 3/001 (2013.01); B29C 65/4895 (2013.01); B81B 2201/058 (2013.01); B81C 2201/019 (2013.01); B81C 2203/037 (2013.01);
Abstract
Provided is a fusing method of a substrate layer including: treating a joining surface of a substrate layer formed from a resin using an organic solvent having solubility with respect to the resin; and heating the treated substrate layer at less than a glass transition temperature or a softening point temperature of the resin and crimping the heated substrate layer.