The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2015

Filed:

Oct. 30, 2008
Applicants:

Rodney R. Rudat, Jackson, TN (US);

Joseph Tapley, Medon, TN (US);

Jay S. Korth, Jackson, TN (US);

Inventors:

Rodney R. Rudat, Jackson, TN (US);

Joseph Tapley, Medon, TN (US);

Jay S. Korth, Jackson, TN (US);

Assignee:

Wabtec Holding Corp., Wilmerding, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 9/02 (2006.01); B23P 15/26 (2006.01); B21D 39/06 (2006.01); B21D 53/06 (2006.01); B21D 53/08 (2006.01); F02B 29/04 (2006.01); F28F 9/16 (2006.01); F28F 21/08 (2006.01); F28F 13/00 (2006.01);
U.S. Cl.
CPC ...
B23P 15/26 (2013.01); B21D 39/06 (2013.01); B21D 53/06 (2013.01); B21D 53/08 (2013.01); F02B 29/0431 (2013.01); F28F 9/16 (2013.01); F28F 21/08 (2013.01); F28F 2265/26 (2013.01); Y02T 10/146 (2013.01); Y10T 29/49375 (2015.01);
Abstract

A heat exchanger, such as an air-to-air after-cooler assembly, having reduced and/or eliminated leakage at the tube/header joint is provided. The assembly comprises a series of tubular members formed from a first metal, each of the tubular members including an end portion and a header formed from a second metal, wherein the first metal and the second metal have similar coefficients of thermal expansions. The header includes a plurality of openings extending therethrough and each of the end portions of the tubular members is mechanically secured within corresponding openings within the header to form an after-cooler assembly. A method for forming the air-to-air after-cooler assembly is also provided.


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