The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2015

Filed:

Jul. 23, 2012
Applicants:

Probir Kumar Guha, Troy, MI (US);

Michael J. Siwajek, Oakland Township, MI (US);

Brad Anthony Haskell, Lake Orion, MI (US);

Sudarsan Neogi, East Brunswick, NJ (US);

Inventors:

Probir Kumar Guha, Troy, MI (US);

Michael J. Siwajek, Oakland Township, MI (US);

Brad Anthony Haskell, Lake Orion, MI (US);

SudarSan Neogi, East Brunswick, NJ (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B05D 3/14 (2006.01); B29C 59/14 (2006.01);
U.S. Cl.
CPC ...
B05D 3/144 (2013.01); B29C 59/14 (2013.01); B29C 2059/147 (2013.01);
Abstract

A process for applying an overlayer to a cured thermoset molding composition is provided that includes exposing the cured thermoset molding composition to a plasma under conditions that modify the surface energy of a surface of the article without visually modifying the surface. The surface of the article is then overcoated with an overlayer having superior adhesion to a like article absent the intermediate plasma treatment. A component is also provided that is cured thermoset resin article having a shape and a surface. An overlayer is applied to the surface while the surface is still plasma activated. The overlayer is adhesion is unchanged by 4 weeks in a 100% humidity chamber at 30° C. over at least 95 area % of an interface between the overlayer and the surface.


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