The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2015
Filed:
Jul. 08, 2011
Applicants:
Nozomu Nishimura, Tokyo, JP;
Nobuhiro Mikami, Tokyo, JP;
Inventors:
Nozomu Nishimura, Tokyo, JP;
Nobuhiro Mikami, Tokyo, JP;
Assignee:
LENOVO INNOVATIONS LIMITED (HONG KONG), Quarry Bay, HK;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/02 (2006.01); H05K 3/28 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H05K 7/02 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H05K 3/284 (2013.01); H05K 3/305 (2013.01); H01L 2224/16225 (2013.01); H05K 2201/2009 (2013.01); H05K 2201/2018 (2013.01); H05K 2203/1316 (2013.01); Y10T 29/4913 (2015.01);
Abstract
A component built-in module of the present invention includes: a substrate which includes a top surface and a bottom surface; a plurality of electronic components which are mounted on the top surface of the substrate; a resin which seals the top surface of the substrate; and a reinforcing plate which is bonded to the bottom surface of the substrate. The reinforcing plate and the resin are bonded to each other.