The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2015

Filed:

Mar. 24, 2014
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Yasuhiro Nishisaka, Nagaokakyo, JP;

Satoshi Matsuno, Nagaokakyo, JP;

Akihiro Yoshida, Nagaokakyo, JP;

Yasunori Taseda, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/18 (2006.01); H01G 4/232 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0306 (2013.01); H01G 4/2325 (2013.01); H05K 1/185 (2013.01); H05K 2201/10636 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1469 (2013.01);
Abstract

A ceramic electronic component includes a ceramic body and an outer electrode. The ceramic body includes first and second principal surfaces, first and second lateral surfaces, and first and second end surfaces. The outer electrode is provided on the first principal surface. The outer electrode includes an underlying electrode layer containing Cu and glass, and a Cu plating layer. The underlying electrode layer is disposed on the first principal surface. The Cu plating layer is disposed on the underlying electrode layer. The Cu plating layer is thicker than the underlying electrode layer.


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