The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2015
Filed:
Oct. 04, 2013
Applicant:
Tyco Electronics Japan G. K., Kanagawa-Ken, JP;
Inventors:
Katsunori Fukuda, Kanagawa, JP;
Akira Torigoe, Tokyo, JP;
Assignee:
Tyco Electronics Japan G.K., Kanagawa-ken, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 3/24 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0306 (2013.01); H05K 3/246 (2013.01); H05K 3/387 (2013.01); H05K 2201/0212 (2013.01); H05K 2201/0215 (2013.01); H05K 2201/0239 (2013.01);
Abstract
A glass wiring board is provided that includes a glass substrate and a primer layer. The prime layer is disposed on the glass substrate and includes an intermediate layer and a copper plating layer disposed on the intermediate layer. The intermediate layer includes a resin coupling agent and a metal element dispersed in the resin coupling agent.