The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2015
Filed:
Jan. 31, 2012
Applicants:
Masanori Ueda, Tokyo, JP;
Masafumi Iwaki, Tokyo, JP;
Tokihiro Nishihara, Tokyo, JP;
Inventors:
Assignee:
TAIYO YUDEN CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 3/02 (2006.01); H03H 3/10 (2006.01); H03H 9/02 (2006.01); H01L 41/312 (2013.01); H01L 41/337 (2013.01); H03H 9/05 (2006.01);
U.S. Cl.
CPC ...
H03H 3/02 (2013.01); H03H 3/10 (2013.01); H03H 9/02574 (2013.01); H01L 41/312 (2013.01); H01L 41/337 (2013.01); H03H 9/0504 (2013.01); Y10T 29/42 (2013.01); Y10T 29/49005 (2015.01); Y10T 29/49153 (2015.01);
Abstract
A method for manufacturing an acoustic wave device includes: bonding a piezoelectric substrate to a first surface of a first support substrate; thinning the piezoelectric substrate after the bonding to thus form a piezoelectric layer; forming a first electrode on a first surface of the piezoelectric layer; forming holes in the first support substrate located below the first electrode; and bonding a second support substrate to a second surface of the first support substrate opposite to the first surface after the forming of holes.